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www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 1/19 26.oct.2012 rev.001 tsz22111 ? 14 ? 001 datasheet operational amplifiers series ground sense operational amplifiers ba3404xxx general description ba3404 is a dual operational amplifier with input and output ground sense. es pecially, ba3404 have wide operating voltage range +4v to +36v (single supply). ba3404 have a good performance of slew rate and cross over distortion compare with ba2904. features ? operable with a single power supply ? wide operating supply voltage ? input and output are operable gnd sense ? low supply current ? high open loop voltage gain ? internal esd protection circuit packages w(typ.)xd(typ.) xh(max.) sop8 5.00mm x 6.20mm x 1.71mm sop-j8 4.90mm x 6.00mm x 1.65mm msop8 2.90mm x 4.00mm x 0.90mm key specification ? wide operating supply voltage (single supply): +4.0v to +36.0v (split supply): 2.0v to 18.0v ? slew rate: 1.2v/s(typ.) ? wide temperature range: -40c to +85c ? input offset current: 5na (typ.) ? input offset voltage: 5mv (max.) application ? current sense application ? buffer application amplifier ? active filter ? consumer electronics block diagrams product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. figure 1. simplified schematic out vcc vee -in +in downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 2/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx pin configuration(top view) pin no. symbol 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc package sop8 sop-j8 msop8 ba3404f ba3404fj ba3404fvm ordering information b a 3 4 0 4 x x x - x x part number. ba3404xxx package f : sop8 fj : sop-j8 fvm : msop8 packaging and forming specification e2: embossed tape and reel (sop8/sop-j8) tr: embossed tape and reel ( msop8) line-up topr supply current (typ.) slew rate (typ.) package orderable part number -40c to +85c 2.0ma 1.2v/s sop8 reel of 2500 ba3404f-e2 sop-j8 reel of 2500 ba3404fj-e2 msop8 reel of 3000 BA3404FVM-TR absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage vcc-vee +36 v power dissipation pd sop8 780 *1*4 mw sop-j8 675 *2*4 msop8 590 *3*4 differential input voltage *5 vid +36 v input common-mode voltage range vicm (vee-0.3) to (vee+36) v operating temperature ra nge topr -40 to +85 storage temperature range tstg -55 to +150 maximum junction temperature tjmax +150 note: absolute maximum rating item indicates the condition which must not be exceeded. application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may c ause deterioration of characteristics. *1 to use at temperature above ta 25 reduce 6.2mw/ *2 to use at temperature above ta 25 reduce 5.4mw/ *3 to use at temperature above ta 25 reduce 4.8mw/ *4 mounted on a fr4 glass epoxy pcb(70mm70mm1.6mm). *5 the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. - + + - - + - + downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 3/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx electrical characteristics ba3404 (unless otherwise spec ified vcc=+15v, vee=-15v, ta=25 ) parameter symbol limits unit condition min. typ. max. input offset voltage *6 vio - 2 5 mv vout=0v, vicm=0v input offset current *6 iio - 5 50 na vout=0v, vicm=0v input bias current *6 ib - 70 200 na vout=0v, vicm=0v large signal voltage gain av 88 100 - db rl 2k ? vout=10v, vicm=0v maximum output voltage vom 13 14 - v rl 2k ? input common-mode voltage range vicm -15 - 13 v vout=0v common-mode rejection ratio cmrr 70 90 - db vout=0v vicm=-15v to +13v power supply rejection ratio psrr 80 94 - db ri 10k ? vcc=+4v to +30v supply current icc - 2.0 3.5 ma rl= , all op-amps vin+=0v output source current isource 20 30 - ma vin+=1v, vin-=0v vout=+12v output of one channel only output sink current isink 10 20 - ma vin+=0v, vin-=1v vout= -12v output of one channel only slew rate sr - 1.2 - v/ s av=0db, rl=2k ? cl=100pf unity gain frequency f t - 1.2 - mhz rl=2k ? gain band width gbw - 1.2 - mhz f=100khz total harmonic distortion thd+n - 0.1 - % vout=10v p-p , f=20khz av=0db, rl=2k ? channel separation cs - 100 - db f=1khz, input referred *6 absolute value downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 4/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx description of electri cal characteristics described here are the terms of electric characteristics used in this datasheet. items and symbols used are also shown. note that item name and symbol and t heir meaning may differ from those on anot her manufactures document or general document. 1. absolute maximum ratings absolute maximum rating item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cau se deterioration of characteristics. 1.1 power supply voltage (vcc-vee) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruct ion of characteristics of internal circuit. 1.2 differential input voltage (vid) indicates the maximum voltage that can be supplied between the non-inverting and inverting terminals without damaging the ic. 1.3 input common-mode voltage range (vicm) indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. input common-mode voltage range of t he maximum ratings not assures normal operation of ic. when normal operation of ic is desired, the input common-mode voltage of characteristics item must be followed. 1.4 power dissipation (pd) indicates the power that can be consumed by specified mounted board at t he ambient temperature 25 (normal temperature). as for package product, pd is determined by the temper ature that can be permitted by ic chip in the package (maximum junction temperature) and t hermal resistance of the package. 2. electrical characteristics 2.1 input offset voltage (vio) indicates the voltage difference between non-inverting terminal and inverting terminal. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2.2 input offset current (iio) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. 2.3 input bias current (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 large signal voltage gain (av) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage fluctuation) / (input offset fluctuation) 2.5 maximum output voltage (vom) signifies the voltage range that can be out put under specific output conditions. 2.6 input common-mode voltage range (vicm) indicates the input voltage range un der which the ic operates normally. 2.7 common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) 2.8 power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volt age)/(input offset fluctuation) 2.9 circuit current (icc) indicates the ic current that flows under specified conditions and no-load steady status. 2.10 output source current/ output sink current (isource/isink) the maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. the output source current indicates the current flowing out of the ic, and the output sink current the current flowing into the ic. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 5/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx 2.11 slew rate (sr) sr is a parameter that shows movement speed of operational amplifier. it indicates rate of variable output voltage as unit time. 2.12 unity gain frequency (f t ) indicates a frequency where the voltage gain of operational amplifier is 1. 2.13 total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. 2.14 gain band width (gbw) indicates to multiply by the frequency and the gai n where the voltage gain decreases 6db/octave. downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 6/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx typical performance curves ba3404 (*)the above data is measurement value of typical sample, it is not guaranteed. b a 3404f b a 3404fvm b a 3404fj figure 3. supply current - supply voltage figure 4. supply current - ambient temperature figure 5. maximum output voltage - load resistance (vcc/vee=+15v/-15v, ta=25 ) figure 2. derating curve 0 200 400 600 800 1000 0 25 50 75 100 125 ambient temperature [ ] a [mw] 85 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 7/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx ba3404 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 6. maximum output voltage C supply voltage figure 7. output voltage - output current (vcc/vee=+15v/-15v, ta=25 ) figure 8. input offset voltage - supply voltage (vicm=0v, vout=0v) figure 9. input offset voltage - ambient temperature (vicm=0v, vout=0v) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 8/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx ba3404 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 10. input bias current - supply voltage (vicm=0v, vout=0v) figure 11. input bias current - ambient temperature (vicm=0v, vout=0v) figure 12. input offset current - supply voltage (vicm=0v, vout=0v) figure 13. input offset current - ambient temperature (vicm=0v, vout=0v) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 9/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx ba3404 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 14. input offset voltage - common mode input voltage (vcc/vee=+2.5v/-2.5v) figure 15. common mode rejection ratio - ambient temperature (vcc/vee=+15v/-15v) figure 16. common mode rejection ratio - ambient temperature (vcc/vee=+15v/-15v) figure 17. large signal voltage gain - supply voltage (rl=2k ? ) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 10/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx ba3404 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 18. large signal voltage gain - ambient temperature (rl=2k ? ) figure 20. slew rate l-h - supply voltage figure 21. slew rate h-l - ambient temperature figure 19. voltage gain ? phase - frequency (vcc=15v) 10 2 10 3 10 4 10 5 10 6 10 7 downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 11/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx ba3404 (*)the above data is measurement value of typical sample, it is not guaranteed. figure 23. equivalent input noise voltage - frequency (vcc/vee=+15v/-15v, rs=100 ? , ta=25 ) figure 22. total harmonic distoration - output voltage (vcc/vee=+4v/-4v, av=0db, rl=2k ? , 80khz-lpf, ta=25 ) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 12/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx application information null method condition for test circuit 1 vcc,vee,ek,vicm unit: v parameter vf s1 s2 s3 vcc vee ek vicm calculation input offset voltage vf1 on on off 15 -15 0 0 1 input offset current vf2 off off off 15 -15 0 0 2 input bias current vf3 off on off 15 -15 0 0 3 vf4 on off large signal voltage gain vf5 on on on 15 -15 10 0 4 vf6 15 -15 -10 0 common-mode rejection ratio (input common-mode voltage range) vf7 on on off 15 -15 0 -15 5 vf8 15 -15 0 13 power supply rejection ratio vf9 on on off 2 -2 0 0 6 vf10 15 -15 0 0 -calculation- 1. input offset voltage (vio) ]v[ rs / rf + 1 vf1 vio ? 2. input offset current (iio) ]a[ rs) / rf + (1 ri vf1 - vf2 iio ? 3. input bias current (ib) ]a[ rs) / rf + (1 ri2 vf3 - vf4 ib ? 4. large signal voltage gain (av) ]db[ vf6 - vf5 rf/rs) +(1 ek log 20 av ? 5. common-mode rejection ration (cmrr) ]db[ vf7 - vf8 rf/rs) +(1 vicm log 20 cmrr ? 6. power supply reje ction ratio (psrr) ]db[ vf9 - vf10 rf/rs) +(1 vcc log 20 psrr ? figure 24. test circuit 1 (one channel only) vf rl 0.1f 500k 500k rf=50k rs=50 ri=10k ek null dut sw1 sw2 vicm 1000pf sw3 vcc vee - + ri=10k rs=50 50k 0.1f downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 13/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx vh vl time t input voltage vh vl t v sr= v/ t t output voltage time switch condition for test circuit 2 sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 sw 8 sw 9 sw 10 sw 11 sw 12 sw 13 sw 14 supply current off off off on off on off off off off off off off off high level output voltage off off on off off on off off on off off off on off low level output voltage off off on off off on off off off off off off on off output source current off off on of f off on off off off off off off off on output sink current off off on off off on off off off off off off off on slew rate off off off on off off off on on on off off off off gain bandwidth product off on off off on on off off on on off off off off equivalent input noise voltage on off off off on on off off off off on off off off figure 25. test circuit 2 (each op-amp) figure 26. slew rate input waveform figure 27. test circuit 3 (channel separation) vc c vee r1 v r2 r1//r2 vou t1 =0.5[vrm s ] vin vc c vee r1 v r2 r1//r2 vou t2 othe r ch cs 20 log 100 vou t1 vou t2 sw1 sw2 sw3 sw10 sw11 sw12 a vin- vin+ rl vcc vee sw9 sw6 sw7 sw8 cl sw13 sw14 a v vout rs sw5 sw4 v r1 r2 c 90% 10% downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 14/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx application example voltage follower inverting amplifier non-inverting amplifier voltage gain is 0 db. this circuit controls output voltage (vout) equal input voltage (vin), and keeps vout with stable because of high input impedance and low output impedance. vout is shown next formula. vout=vin for inverting amplifier, vin is amplified by voltage gain decided r1 and r2, and phase reversed voltage is output. vout is shown next expression. vout=-(r2/r1) ? vin input impedance is r1. for non-inverting amplifier, vin is amplified by voltage gain decided r1 and r2, and phase is same with vin. vout is shown next expression. vout= (1+r2/r1) ? vin this circuit performes high input impedance because input impedance is operational amplifiers input impedance. vee vout vin vcc r2 r1 vee r1//r2 vin vout vcc vee r2 vcc vin vout r1 figure 28. voltage follower circuit figure 29. inverting amplifier circuit figure 30. non-inverting amplifier circuit downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 15/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx figure 31. thermal resistance and derating power dissipation power dissipation (total loss) indicates the power that can be consumed by ic at ta=25 (normal temperature). ic is heated when it consumed power, and the temperature of ic chip becomes higher than ambient temperature. the temperature that can be accepted by ic chip depends on ci rcuit configuration, manufacturing process, and consumable power is limited. power dissipation is determined by the temper ature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is typically equal to the maximum value in the storage temperature range. heat generat ed by consumed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance, represented by the symbol ja /w.the temperature of ic inside the package can be estimated by this thermal resistance. figure 31. (a) shows the model of thermal resistance of the package. thermal resistance ja, ambient temperature ta, maximum junction temperature tjmax, and power dissipation pd can be calculated by the equation below: ja = (tjmax-ta) / pd /w ????? ( ) derating curve in figure 31. (b) indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a refer ence value measured at a specified cond ition. figure 32. (c) show a derating curve for an example of ba3404. (*7) (*8) (*9) unit 6.2 5.4 4.8 mw/ when using the unit above ta=25 , subtract the value above per degree . permissible dissipation is the value w hen fr4 glass epoxy board 70mm 70mm 1.6mm (cooper foil area below 3%) is mounted. 0 200 400 600 800 1000 0 2 55 07 51 0 01 2 5 ??? ta [ ] p? pd [mw] figure 32. derating curve (a)thermal resistance (b) derating curve ?? ta [ ] ? ? tj [ ] M [] ambient temperature chip surface temperature power dissipation pd[w] 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi power dissipation pd [mw] ambient temperature ta [ ] (c)ba3404 ja=(tjmax-ta)/pd /w 780mw( * 7) 590mw( * 9) ba3404f ba3404fvm ba3404fj 675mw( * 8) downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 16/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx operational notes 1) unused circuits when there are unused circuits, it is reco mmended that they be connected as in figure 33. setting the non-inverting input terminal to a potential within the in-phase input voltage range (vicm). 2) input voltage applying vee+36v(ba3404 ) to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 3) power supply (single / dual) the op-amp operates when the voltage supplied is between v cc and vee therefore, the single supply op-mp can be used as a dual supply op-amp as well. 4) power dissipation (pd) using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to the rise in chip temperature, including reduced current capability. ther efore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a sufficient margin in thermal design. refer to the thermal derating curves for more information. 5) short-circuit between pins and erroneous mounting incorrect mounting may damage the ic. in addition, the presence of foreign substances between the outputs, the output and the power supply, or the output and gnd may result in ic destruction. 6) operation in a strong electromagnetic field operation in a strong electromagnet ic field may cause malfunctions. 7) radiation this ic is not designed to withstand radiation. 8) ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluctuation of the electrical characteristics due to piezo resistance effects. 9) ic operation the output stage of the ic is configured using class c push-pull circuits. therefore, when the load resistor is connected to the middle potential of vcc and vee, crossover distor tion occurs at the changeover between discharging and charging of the output current. connecting a resistor betwe en the output terminal and gnd, and increasing the bias current for class a operation will suppress crossover distortion. 10) board inspection connecting a capacitor to a pin with low impedance may stress the ic. therefore, discharging the capacitor after every process is recommended. in addition, when attaching and detac hing the jig during the inspection phase, ensure that the power is turned off before inspection and removal. furtherm ore, please take measures against esd in the assembly process as well as during transportation and storage. 11) output capacitor discharge of the external output capacitor to vcc is possible via internal parasitic elements when vcc is shorted to vee, causing damage to the internal circuitry due to thermal stress. therefore, when using this ic in circuits where oscillation due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance less than 0.1 f. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. connect to vicm vcc vee vicm - + application circuit for unused op-amp figure 33. the example of downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 17/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx physical dimensions tape and reel information (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 4 0.17 +0.1 - 0.05 0.595 6 43 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 57 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05C0.04 0.6 0.2 0.29 0.15 0.145 +0.05C0.03 4 + 6 4 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop-j8 4 + 6 4 0.2 0.1 0.45min 234 5678 1 4.9 0.2 0.545 3.9 0.2 6.0 0.3 (max 5.25 include burr) 0.42 0.1 1.27 0.175 1.375 0.1 0.1 s s downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 18/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx marking diagrams product name package type marking ba3404 f sop8 3404 fj sop-j8 fvm msop8 land pattern data all dimensions in mm pkg land pitch e land space mie land length ? 2 land width b2 sop8 1.27 4.60 1.10 0.76 sop-j8 1.27 3.90 1.35 0.76 msop8 0.65 2.62 0.99 0.35 sop8(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark sop-j8(top view) part number marking lot numbe r 1pin mark b e ? downloaded from: http:///
datasheet www.rohm.com tsz02201-0rar1g200140-1-2 ? 2012 rohm co., ltd. all rights reserved. 19/19 26.oct.2012 rev.001 tsz22111 ? 15 ? 001 ba3404xxx revision history date revision changes 2012.10.22 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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